Teradyne moved burn-in from dedicated oven banks onto the Titan HP system-level test platform. Each device runs a realistic workload at a controlled junction temperature, with its stress and test history kept in one record. The constraint being removed is the equipment and data handoff between hours of reliability stress and the functional test that decides whether a part ships.
Per-site thermal control lets Titan HP tune stress to each device's power and thermal zones. Its asynchronous slot architecture loads and tests slots independently, so one long stress run does not idle the rest of the system. Test programs run on the Atlas software platform and can move across Teradyne system-level test systems, keeping program reuse attached to the device flow instead of the oven.
Titan HP with enhanced burn-in is available now and deployed in production. AI accelerator teams should compare the floor space, handling steps, and data joins in their oven flow against one integrated cell. Dedicated burn-in equipment will lose high-power devices wherever it cannot produce a continuous per-device validation record.